International Journal of Information Technology & Computer Science ( IJITCS )
Advanced process control (APC) has been recognized as a proper tool for maximizing profitability of semiconductor manufacturing facilities by improving efficiency and product quality. Run-to-run (RtR) process control with good quality and reliable performance for APC applications are most applicable. This paper conducts performance assessment on four RtR mixed product control schemes which are available in the literature: thread EWMA (t-EWMA), thread PCC (tPCC), JADE and m-dEWMA, with actual overlay historical mixed product processes data. Meantime, the comparison also includes the moving average three (MA(3)) method which is commonly used in semiconductor factories. The simulation results revealed that t-EWMA, tPCC and m-dEWMA could be used in overlay mixed product processes, but the JADE was not recommended to be applied in overlay mixed product processes.
: advanced process control; run-to-run; overlay; mixed product; m-dEWMA control scheme;
 M. A. Drew, M. G. Hanssmann, and D. Camporese, “Automation and Control for 300 mm Process Tools,” Solid State Technol. vol. 40, no. 1, pp. 51-64, 1997.
 A. V. Prabhu and T. F. Edgar, “A new state estimation method for highmix semiconductor manufacturing process,” J. Process Control, vol. 19, no. 7, pp. 1149-1161, 2009.
 S. Adivikolanu and E. Zafiriou, “Extensions and Performance/Robustness Tradeoffs of the EWMA Run-to-Run Controller by Using the Internal Model Control Structure,” IEEE Trans. Electron. Packag. Manuf., vol. 23, no. 1, pp. 56-68, January. 2000.
 E. D. Castillo, “Some Properties of EWMA Feedback Quality Adjustment Schemes for Drifting Disturbances,” J. Qual. Technol., vol. 33, no. 2, pp. 153-166, April 2001.
 Z. C. Lin and W. J. Wu, “Multiple Linear Regression Analysis of the Overlay Accuracy Model,” IEEE Trans. Semicond. Manuf., vol. 12, no. 2, pp. 229-237, May 1999.
 V. M. Martinez, K. Finn and T. F. Edgar, “Adaptive on-line estimation and control of overlay tool bias,” Proc. SPIE, Advanced Process Control and Automation vol. 5044, pp. 52-62, 2003.
 C. A. Bode, B. S. Ko, and T. F. Edgar, “Run-to-run control and performance monitoring of overlay in semiconductor manufacturing,” Control Engineering Practice, vol. 12, no. 7, pp. 893-900, 2004.
 S. A. Middlebrooks, “Optimal Model-Predictive Control of Overlay lithography implemented in an ASIC fab,” SPIE, Advanced Process Control and Automation, vol. 5044, pp. 12–23, 2003.
 A. C. Lee, Y. R. Pan and M. T. Hsieh, “Output Disturbance Observer Structure Applied to Run-to-Run Control for Semiconductor Manufacturing.” IEEE Trans. Semicond. Manuf., vol. 24, no. 1, pp. 2743, February 2011.
 D. S. Lee and A. C. Lee, “Pheromone Propagation Controller: the Linkage of Swarm Intelligence and Advanced Process Control” IEEE Trans. Semicond. Manuf., vol. 22, no. 3, pp. 357-372, August 2009.  J. H. Chen, T. W. Kuo and A. C. Lee, “Run-by-Run Process Control of Metal Sputter Deposition: Combining Time Series and Extended Kalman Filter,” IEEE trans. Semicond. Manuf., vol. 20, no. 3, pp. 278285, August 2007.  C. F. Wu, C. M. Hung, J. H. Chen and A. C. Lee, “Advanced Process Control of the Critical Dimension in Photolithography,” Int. J. of Precision Engineering and Manufacturing, vol. 9, no. 1, pp. 12-18, 2008.
 S. K. Firth, W. J. Campbell and A. Toprac, “Just-in-Time Adaptive Disturbance Estimation for Run-to-Run Control of Semiconductor Processes,” IEEE Trans. Semicond. Manuf., vol. 19, no. 3, pp. 298-315, 2006.
 Y. Zheng, Q. H. Lin, D. S. H. Wang, S. S. Jang, and K. Hui, “Stability and performance analysis of mix product run-to-run control,” J. Process Control, vol. 16, pp. 431-443, 2006.
 B. Ai, Y. Zheng, S. S. Jang, Y. Wang, L. Ye and C. Zhou, “The optimal drift-compensatory and fault tolerant approach for mixed-product run-torun control,” J. Process Control, vol. 19, no. 8, pp. 1401-1412, 2009 B. Ai, Y. Zheng, Y. Wang, S. S. Jang and T. Song, “Cycle forecasting EWMA (CF-EWMA) approach for drift and fault in mixed-product runto-run process,” J. Process Control, vol. 20, no. 5, pp. 689-708, 2010. A. C. Lee, T. W. Kuo and Z. L. Lee, “Modified Double EWMA Approach for Mixed Product Run-to-Run CMP Process Control,” Advanced Materials Research, vol. 314-316, pp. 2504-2511, August 2011.
 D. Schmidt and G. Charache, “Wafer process-induced distortion study for X-ray technology,” J. Vac. Sci. Technol. B, vol. 9, no. 6, pp. 32373240, 1991 M. A. Brink, C. G. M. Mol and R. A. George, “Matching performance for multiple wafer steppers using a advanced metrology procedure,” Proc. SPIE: Integrated Circuit Metrology, Inspection, and Process Control Ⅱ, vol. 921, pp. 180-197, 1988.
 W. H. Arnold, “Image placement differences between 1:1 projection aligners and 10:1 reduction wafer steppers,” Proc. SPIE: Optical Microlithography, vol. 394, pp. 87-98, 1983.